Vol11(spl.Edn.2)
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Karelina M. Y, Prikhodko V. M, Semin M. I. Modeling of Contact Connecting Layer of Compound Rod in Designing of Adhesive and Adhesive Mechanical Joints. Biosci Biotech Res Asia 2014;11(spl.edn.2)
Manuscript received on : 27 September 2014
Manuscript accepted on : 10 October 2014
Published online on:  --
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Modeling of Contact Connecting Layer of Compound Rod in Designing of Adhesive and Adhesive Mechanical Joints

Maria Yu. Karelina, Vjacheslav M. Prikhodko and Mikhail I. Semin

The Moscow State Automobile and Road Technical University (MADI), 125319, MADI, Leningradsky prospect, building 64, Moscow, Russia.

DOI : http://dx.doi.org/10.13005/bbra/1451

ABSTRACT: A dynamic analytical model of the compound, which allows taking into account the different types of the non-linearity contact connecting layer. Taking into account the accepted assumptions there longitudinal and bending vibrations of distinctive feature three-layer rod are described.

KEYWORDS: Dynamic model of bonded-mechanical compound, Fluctuations differential element, contact connecting layer.

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Karelina M. Y, Prikhodko V. M, Semin M. I. Modeling of Contact Connecting Layer of Compound Rod in Designing of Adhesive and Adhesive Mechanical Joints. Biosci Biotech Res Asia 2014;11(spl.edn.2)

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Karelina M. Y, Prikhodko V. M, Semin M. I. Modeling of Contact Connecting Layer of Compound Rod in Designing of Adhesive and Adhesive Mechanical Joints. Biosci Biotech Res Asia 2014;11(spl.edn.2). Available from:https://www.biotech-asia.org/?p=12053

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